Key Responsibilities

1. Customer Engagement & Support

• Serve as the main technical liaison for all assembly-related activities at the customer site.

• Understand and translate customer requirements into internal actions; support New Product Introduction (NPI), production ramp-up, and ongoing support.

• Communicate effectively with customer stakeholders, providing updates on assembly progress, issues, and corrective actions.

• Drive customer satisfaction through responsiveness, technical support, and proactive issue resolution.

2. OSAT Oversight & Management

• Oversee daily OSAT operations including assembly line performance, equipment status, process metrics, and yield monitoring.

• Provide hands-on technical guidance for process development, debugging, and improvements at OSATs.

• Ensure OSAT compliance with internal process standards and customer-specific requirements.

• Review and approve process documentation (flow charts, work instructions, control plans).

• Lead or support qualification activities for material, equipment, and process changes.

3. Yield, Quality, and Process Improvement

• Monitor and analyze key metrics such as yield, cycle time, and defect rates.

• Conduct root cause analysis using methodologies like 8D, DMAIC to resolve production issues.

• Lead continuous improvement projects to reduce cost of poor quality (COPQ) and enhance process capability.

• Collaborate with Quality, FA, and Engineering teams for fast-track issue resolution.

4. Documentation & Reporting

• Maintain up-to-date documentation of all engineering actions, process risks, and change logs.

• Prepare weekly and monthly reports summarizing OSAT KPIs, open issues, and customer feedback.

• Manage and track process change notifications (PCNs) and engineering change orders (ECOs) related to assembly operations.

Education & Experience

• Bachelor’s degree or higher in Materials Science, Mechanical Engineering, Electronics Engineering, or related field.

• Minimum 3 years of experience in semiconductor assembly and packaging.

• Prior experience managing or working directly with OSATs is highly preferred.

Technical Skills

• Strong knowledge of backend assembly processes: die attach, wire bonding, molding, singulation, etc.

• Skilled in process control tools: FMEA, SPC, DOE, 8D, etc.

• Familiarity with manufacturing standards (JEDEC, IPC) and quality systems (ISO, IATF).

• Proficient in data analysis and reporting tools (e.g., JMP, Minitab, Excel).

Soft Skills

• Excellent verbal and written communication skills, particularly in customer-facing roles.

• Strong interpersonal skills with the ability to manage cross-functional collaboration.

• Self-driven, highly organized, and effective at multitasking under pressure.

• Proven project and time management abilities.

Benefits & Welfare